Business
Thermal Process Technology
We provide rapid thermal process equipment, the core equipment in the
entire process of semiconductors, to the client companies.
- Rapid Thermal Processing(RTP) equipment, which treats wafers with high temperature in a short time using tungsten halogen lamps, is applied to
various processes such as implantation and diffusion.
- Rapid Thermal Process
-
SoakSpike
Technology
It is a non-contact rotation using magnet properties (Magnetic Levitation), which secures excellent temperature uniformity within the surface.
Specification
| Spec Items | Unit | Specification |
|---|---|---|
| Temperature Reading Range | ℃ | 400 ~ 1250 |
| Temperature Control Range | ℃ | 435 ~ 1200 |
| Temperature Ramping-Up Rate | ℃/sec | Up: 250℃/sec, Down: -90℃/sec |
| Process Pressure | Torr | 780±2 ~ 1×10-3 |
| RTO Range @ 1100℃, 60sec, X-scan, 49Points, 3 EE | Å, 1σ | ≤±0.5 |
| Rs Range @ 700 ~ 1100℃, X-scan, 81Points, 3 EE | Ω/Sq, 1σ | ≤15 |
| Pyrometer to Pyrometer Peak Temp Uniformity | ℃ | Target±1.0℃ @Bare Wafer |
| RTO/Rs Non-uniformity | %,1σ | RTO: 0.48%, Rs: 0.72% |
| RTO/Rs Repeatability | %,1σ | ≤1.5%, 1σ |
| Temp. Stability & Repeatability | ℃ | <±1.0℃ |
| Rs WTW Non-Uniformity | %,1σ | <1%, 1σ |
| Mechanical Throughput (2 Chambers) | WPH | 142 |
Features
- 2 Chamber
- ATM equipment
- 3 Load Port
- Integral MPD
| Item | Description | Unit | Specification | Remarks | |
|---|---|---|---|---|---|
| EFEM | Load Port | Quantity | Set | 3 | LPP(option) |
| ATM-Dual Robot | Set | 1 | |||
| Process Module | Heater Block | Process Pressure | Torr | 800 ~ ATM | |
| Ch. Body | |||||
| T Shape LAMP | Quantity | ea | 290 | ||
| Power | Electrical Rack | SPEC | General Power | 208V, 3PH, MCCB630A | |
| Temp. Control | Performance | Control Range | ℃ | 450 ~ 1150℃ | ±1.5℃ Control |
| Ramping-Up | ℃ | Max. +250℃/sec | spike | ||
| Ramping-Down | ℃ | Max. -90℃/sec | |||
| Pyrometers per chamber | Quantity | ea | 5 | ||
| Process | 49 Points RTO | Range | Å | ≤1 @1σ | |
Features
- 3 Chamber
- Vacuum equipment
- 3 Load Port
- Seperate MPD Box on the lower side
| Item | Description | Unit | Specification | Remarks | |
|---|---|---|---|---|---|
| EFEM | Load Port | Quantity | Set | 3 | LPP(option) |
| ATM-Dual Robot | Set | 1(with Aligner) | |||
| VTM | Stack Load Lock | Quantity | Set | 4 | Particle Free |
| Pentagon VTM | Set | 1 | |||
| Process Module | Heater Block | Process Pressure | Torr | >2 | |
| Ch. Body | |||||
| T Shape LAMP | Quantity | ea | 290 | ||
| MPD | Electrical Rack | Quantity | Set | 3 | |
| SPEC | General Power | 208V, 3PH, MCCB630A | |||
| Temp. Control | Performance | Control Range | ℃ | 450 ~ 1150℃ | ±0.5℃ Control |
| Ramping-Up | ℃ | Max. +100℃/sec | |||
| Ramping-Down | ℃ | Max. -40℃/sec | |||
| Pyrometers per chamber | Quantity | ea | 5 | ||
| Process | 49 Points RTO | Range | Å | ≤1 @1σ | |
